Transducers Industry Session
Sunday, 29 June
12:30 - 17:00

On Sunday afternoon we will hold a series of MEMS-industry sessions during which leaders from the MEMS industry will speak about topics of significant interest to the Transducers community. These topics will include historical perspectives and lessons learned during the development and commercialization of inertial MEMS as well as the current and future expectations of the industry as a whole. There will be sessions that focus on the following specific topics of interest to the MEMS industry: innovations in materials, devices, modeling, AI, and heterogeneous integration. We not only encourage all attendees to come to the Transducers 2025 Industry Session, we particularly encourage students and other members of the MEMS industry to attend and participate in the event.

Session 1 - MEMS-History and Overview
12:30 - 13:50

12:30 - 13:30 - History of the Translation and Development of Commercial MEMS Inertial Sensors (Panel Discussion)

• Panelist: Emma Abel (Bosch)
• Panelist: David Monk (NXP)
• Panelist: Michael Judy (Draper)
• Moderator: Jason Weigold (MEMStaff)

13:30 - 13:50 - MSIG and MEMS Market Overview

• Speaker: Paul Carey (SEMI)

Session 2 - Innovations in Process Techniques and Device Operation
14:05 - 15:25

This session will explore the latest advances in transducers materials and devices, highlighting advanced techniques that enhance performance, reliability, and new device operations. Attendees will learn about innovative methods for integrating new materials into MEMS and emerging disruptive audio MEMS technologies. The session will include real-world case studies demonstrating the practical applications and benefits of these technologies across various industries.

14:05 - 14:25 - Microstructures for the Manipulation of Photon, Electron, and Ion Beams

• Speaker: Joost van Beek (Xiver)

14:25 - 14:45 - Ultra-High Piezoelectric Coupling in AlScN Thin Films Deposited by Lam Research Pulsed Laser Deposition Platform

• Speaker: Allan He (LAM Research)

14:45 - 15:05 - Miniaturized Directional Audio Sensing and Applications – Innovations Inspired by Nature

• Speaker: Wan-Thai Hsu (Soundskrit)

15:05 - 15:25 - The X Factor in MEMS: Rapid Innovation Across Three Product Lines – All from One Powerful Platform!

• Speaker: Chiung Lo (xMEMS)

Session 3 - Innovations in Transducers Modeling and Heterogeneous Integration
15:40 - 17:00

In the first half of this session, top-tier companies in finite element modeling will provide examples of how reduced-order models based on intelligent mathematical methods can speed up simulation, and physics-based simulation apps customized for specific needs can support and democratize device development. In the second part of this session, the focus will shift towards heterogeneous integration and advanced packaging and two global leaders in nanotechnology innovation and semiconductor manufacturing will provide their perspective on how to integrate multiple technologies in a small form factor with the goal of making smarter and more capable transducer systems.

15:40 - 16:00 - Model-Driven MEMS Design Automation: Bridging Concept to Production with Reduced Order Modeling

• Speaker: Jan Mehner (i-ROM)

16:00 - 16:20 - New Trends for Multiphysics Modeling, Simulation Apps, and Surrogate Models for the MEMS Industry

• Speaker: Mark Cops (COMSOL)

16:20 - 16:40 - Heterogeneous Integration and Advanced Packaging

• Speaker: Pierre Damien Berger (CEA-Leti)

16:40 - 17:00 - Advanced Large-Scale Production of Heterogeneous-Integration-Enabled Devices

• Speaker: Gustavo Gil (Skywater)